-
Company ProfileCompany ProfileEnterprise honorDevelopment coursePartners
-
Process TechnologySemiconductor Wafer Fabrication ProcessCleaning Process in FABWet EtchingPhotoresist Stripping and Cleaning
-
Single Wafer Backside EtcherBench CleaningSingle PR RemoveSingle Wafer Etcher
Development History
2024
2024 - Suzhou branch was established
•The company's organizational structure is optimized
2023
2023 - Key patents take shape
•Etch process technology iteration
•Vacuum and plasma process coupling
•Single-type device DFM
•Autonomy of core parts
2022
2022 - Process precipitation and extension
•SC type bench cleaning equipment
•PA cleaning process equipment
•RCA cleaning process equipment
•GATE cleaning process equipment
2020
2020-Component verification and complete machine development
•Analysis of cavity material effects
•Mechanical structure coupling
•Thermal module materials and design
•Mass production and delivery of bench cleaning equipment
2018
The R&D team was reorganized
•R&D restructuring in Taiwan and China
•Iteration of packaging and testing and advanced packaging cleaning technology
•Samples of glass-based cleaning technology were obtained
•Thermal Engineering and Fluid Mechanics Validation
•Research on semiconductor silicon-based material dielectrics
•Verification of chemical solutions and their reaction principles
Address: 101 & 201, East Unit; 102 & 202, West Unit, Building 8, Phase I, Block V, Hengtai IMP, Suzhou Nano City, No. 75 Pudian Road, Suzhou Industrial Park
Public account