The SC200-B02 is efficient, intelligent and accurate. It is capable of cleaning and etching the backside of 6- to 8-inch wafers, demonstrating great versatility. The PC+PLC control system ensures the intelligence and stability of the operation, supports a variety of industry standard protocols, and is easily integrated into the modern production line. The application of Bernoulli Fork manipulator has improved the accuracy and efficiency to a new level, and the whole process of contactless operation protects the wafer intact. Coupled with excellent temperature, concentration, pressure and flow control, this machine is undoubtedly the ideal choice to improve production efficiency and ensure product quality.
Guangdong KDW Intelligent Equipment Co.,Ltd.
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