Single Wafer Backside Etcher
The SC200-B02 is efficient, intelligent and accurate. It is capable of cleaning and etching the backside of 6- to 8-inch wafers, demonstrating great versatility. The PC+PLC control system ensures the intelligence and stability of the operation, supports a variety of industry standard protocols, and is easily integrated into the modern production line. The application of Bernoulli Fork manipulator has improved the accuracy and efficiency to a new level, and the whole process of contactless operation protects the wafer intact. Coupled with excellent temperature, concentration, pressure and flow control, this machine is undoubtedly the ideal choice to improve production efficiency and ensure product quality.
Product Description
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Model |
SC200-B02 |
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Size Wafer |
Dimensions |
6 "/8" |
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Wafer thickness |
≥ 100um |
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Warpage |
≤ 6mm |
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process application |
Wafer backside etching and cleaning |
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Process indicators |
Breakage rate |
≤ 1/10000 |
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UPTIME |
≥95% |
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software control |
PC PLC configuration, support GEM/SECS,EAP,FDC and other functions |
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Configuration |
2 process chambers (expandable to 4-8 chambers) |
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2 load ports |
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Breakage rateRobot and spin chuck with Bernoulli Fork |
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Can be configured with 2-6 chemicals |
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CDS, concentration meter(option) |
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Good control function on temperature, concentration, pressure and liquid flow |
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Business license
Address: 101 & 201, East Unit; 102 & 202, West Unit, Building 8, Phase I, Block V, Hengtai IMP, Suzhou Nano City, No. 75 Pudian Road, Suzhou Industrial Park
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