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Single Wafer Backside Etcher

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Single Wafer Etcher

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Single Wafer Backside Etcher

The SC200-B02 is efficient, intelligent and accurate. It is capable of cleaning and etching the backside of 6- to 8-inch wafers, demonstrating great versatility. The PC+PLC control system ensures the intelligence and stability of the operation, supports a variety of industry standard protocols, and is easily integrated into the modern production line. The application of Bernoulli Fork manipulator has improved the accuracy and efficiency to a new level, and the whole process of contactless operation protects the wafer intact. Coupled with excellent temperature, concentration, pressure and flow control, this machine is undoubtedly the ideal choice to improve production efficiency and ensure product quality.

Product Description

Model	SC200-B02
Size Wafer	Dimensions	6 "/8"
	Wafer thickness	≥ 100um
	Warpage	≤ 6mm
process application	Wafer backside etching and cleaning
Process indicators	Breakage rate	≤ 1/10000
	UPTIME	≥95%
software control	PC PLC configuration, support GEM/SECS,EAP,FDC and other functions
Configuration	2 process chambers (expandable to 4-8 chambers)
	2 load ports
	Breakage rateRobot and spin chuck with Bernoulli Fork
	Can be configured with 2-6 chemicals
	CDS, concentration meter(option)
	Good control function on temperature, concentration, pressure and liquid flow

Guangdong KDW Intelligent Equipment Co.,Ltd.

粤ICP备2024271198号-1

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Address: 3rd Floor, Building A1, No. 38 Jingfu East Road, Yangwu Village, Dalang Town, Dongguan City

Tel: +86-0769-81789005

E-mail: sales@kdwtech.cn

Guangdong KDW Intelligent Equipment Co.,Ltd.

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