Semiconductor Wafer Fabrication Process
What is the process of a chip from design to final packaging to customer? First of all, chip design includes circuit design and process design, where circuit design is usually carried out using CAD software. This is followed by reticle fabrication, which is a critical step in transferring the design pattern onto the silicon wafer.
Secondly, in the manufacturing process, the production of silicon wafers is the beginning of the advent of chips. When it transforms from polysilicon to monocrystalline silicon, it completes a magnificent transformation and enters the process of wafer fabrication. After a series of steps such as cleaning, grinding, sputtering, circularization, ion implantation, and post-etching cleaning of monocrystalline silicon in the wafer section, the core process of chip manufacturing has been completed. Among these steps, the cleaning step is particularly critical to ensure the cleanliness of the wafer surface after each process stage.
Finally, there are steps such as post-polishing cleaning, WAT testing (wafer acceptability testing), and packaging. Encapsulation is the encapsulation of the chip in a protective case for easy installation and connection. The packaging process also includes steps such as grinding, dicing, wafer spot testing, and chip packaging. Steps such as TSV cleaning, UBM cleaning, and RDL cleaning also play an important role in the packaging process.
When the chip has undergone IC testing and burn-in inspection to ensure that its performance and reliability meet the requirements, it can be delivered to the customer. From an obscure polysilicon to a chip that integrates technology.
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