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Process TechnologySemiconductor Wafer Fabrication ProcessCleaning Process in FABWet EtchingPhotoresist Stripping and Cleaning
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Single Wafer Backside EtcherBench CleaningSingle PR RemoveSingle Wafer Etcher
Single PR Remove
Product Description
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Model |
SR300-F05 |
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Size Wafer |
6 "/8"/12" |
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process application |
Wafer Photoresistive and Polymer Removal |
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Process indicators |
Breakage rate |
≤ 1/20000 |
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UPTIME |
≥95% |
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Particle |
≤ 20@0.2um |
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software control |
PC PLC configuration, support E84,GEM/SECS,EAP,FDC and other functions |
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Configuration |
One to two soaking tanks (customizable) |
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One to four high-pressure Jet processing chambers (customizable) |
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One to four Rinsing and drying chambers (customizable) |
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The multi-grade filter mechanism is designed for easy maintenance |
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Configured with DICO2 function(Option) |
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CDS, concentration meter(Option) |
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Good control function on temperature, concentration, pressure and liquid flow |
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Address: 101 & 201, East Unit; 102 & 202, West Unit, Building 8, Phase I, Block V, Hengtai IMP, Suzhou Nano City, No. 75 Pudian Road, Suzhou Industrial Park
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