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Single Wafer Backside EtcherBench CleaningSingle PR RemoveSingle Wafer Etcher
Single PR Remove
Product Description
Model |
SR300-F05 |
|
Size Wafer |
6 "/8"/12" |
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process application |
Wafer Photoresistive and Polymer Removal |
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Process indicators |
Breakage rate |
≤ 1/20000 |
UPTIME |
≥95% |
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Particle |
≤ 20@0.2um |
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software control |
PC PLC configuration, support E84,GEM/SECS,EAP,FDC and other functions |
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Configuration |
One to two soaking tanks (customizable) |
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One to four high-pressure Jet processing chambers (customizable) |
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One to four Rinsing and drying chambers (customizable) |
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The multi-grade filter mechanism is designed for easy maintenance |
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Configured with DICO2 function(Option) |
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CDS, concentration meter(Option) |
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Good control function on temperature, concentration, pressure and liquid flow |
Guangdong KDW Intelligent Equipment Co.,Ltd.
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Address: 3rd Floor, Building A1, No. 38 Jingfu East Road, Yangwu Village, Dalang Town, Dongguan City



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