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Process TechnologySemiconductor Wafer Fabrication ProcessCleaning Process in FABWet EtchingPhotoresist Stripping and Cleaning
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Single Wafer Backside EtcherBench CleaningSingle PR RemoveSingle Wafer Etcher
Bench Cleaning
Product Description
Model |
BL300-A06 |
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Size Wafer |
12" |
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process application |
Wafer RCA cleaning, PR STRIP, dielectric film etching, metal etching, organic cleaning, wafer regeneration, etc. |
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Process indicators |
Breakage rate |
≤ 1/100000 |
UPTIME |
≥95% |
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Particle |
≤ 20@0.09um |
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software control |
PC PLC configuration, support E84,GEM/SECS,EAP,FDC and other functions |
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Configuration |
6 process tanks (4-14 tanks can be customized) |
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Advanced IPA Drying Unit |
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Reliable EFEM system with 2-4 FOUP Load ports |
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Multiple transfer arms and isolation Shuttles improve efficiency and prevent cross-contamination |
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CDS, concentration meter(option) |
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Good control function on temperature, concentration, pressure and liquid flow |
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Perfect safety protection mechanism, including anti-collision, water leakage and automatic fire protection system |
Guangdong KDW Intelligent Equipment Co.,Ltd.
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Address: 3rd Floor, Building A1, No. 38 Jingfu East Road, Yangwu Village, Dalang Town, Dongguan City



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