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Process TechnologySemiconductor Wafer Fabrication ProcessCleaning Process in FABWet EtchingPhotoresist Stripping and Cleaning
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Single Wafer Backside EtcherBench CleaningSingle PR RemoveSingle Wafer Etcher
Single Wafer Etcher
Product Description
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Model |
SC300-F08 |
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Size Wafer |
12" |
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process application |
Wafer single etching and cleaning |
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Process indicator |
Breakage rate |
≤ 1/20000 |
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UPTIME |
≥95% |
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Particle |
≤ 20@0.06um |
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software control |
PC PLC configuration, support E84,GEM/SECS,EAP,FDC and other functions |
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Configuration |
8 process chambers (2-8 chambers can be customized) |
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Reliable EFEM system with two-four FOUP Load ports |
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2-6 chemicals application can be configured |
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Reliable chemical reclaim system design, reclaim rate > 95% |
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DIO3 system(Option) |
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Local CDS, concentration meter(Option) |
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Good control function on temperature, concentration, pressure and liquid flow |
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Address: 101 & 201, East Unit; 102 & 202, West Unit, Building 8, Phase I, Block V, Hengtai IMP, Suzhou Nano City, No. 75 Pudian Road, Suzhou Industrial Park
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