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2024

The semiconductor advanced packaging track is blowing

Recently, manufacturers such as ASE Holdings, TSMC, Tongfu Microelectronics, Huatian Technology, Yongsi Electronics, and Jingfang Technology have successively announced that they have invested resources to deploy advanced packaging-related technologies and expand production capacity, and related projects point to AI applications such as high-performance storage and high-performance computing. In addition, in 2024, driven by the application trend of the downstream market of memory, artificial intelligence and high-performance computing, the performance highlights of many packaging and testing manufacturers will appear frequently.

On October 28, ASE Investment Holdings, a leading semiconductor packaging and testing company, publicly stated that its silicon precision company is expected to spend NT$419 million to obtain the land use right of Changhua Erlin Park in Taiwan, China, with a lease term of up to 42 years. Market sources pointed out that the investment of Silicon Precision this time is mainly to expand the production capacity of CoWoS advanced packaging.

According to the latest news from people in the upstream of the semiconductor industry chain, TSMC, which acquired Innolux's 5.5 generation LCD panel factory in Nanke in August this year, intends to acquire more Innolux factories near the factories it has acquired. It is reported that TSMC acquired the above-mentioned factory of Innolux for NT$17.14 billion in mid-August, which is now called Advanced Back-End Wafer Fab 8 (AP8). Previously, supply chain sources revealed that the plant will start delivery in April next year and will be able to produce in the second half of next year at the earliest. According to the analysis of the industry, the scale of Innolux's plant is about 9 times that of Zhunan Advanced Packaging and Testing Factory, and at this stage, it is still based on the CoWoS production capacity layout, but it is not excluded that advanced packaging production lines such as fan-out type and 3DIC will be added in the future

On October 28, Runxin Technology announced that the company (Party B) and Singular Moore (Shanghai) Integrated Circuit Design Co., Ltd. (Party A) jointly signed the "CoWoS-S Heterogeneous Integrated Packaging Service Agreement" on October 28, 2024. Party A entrusts Party B to implement the CoWoS-S packaging project, integrate core resources such as storage and computing, and complete the packaging, testing and tape-out in the advanced packaging plant according to Party A's heterogeneous integrated design requirements. The company said that the smooth implementation of the agreement is expected to have a positive impact on the company's resource integration in new business areas such as AI base layer and computing power chips

In terms of Huatian Technology, its Pangu Semiconductor Advanced Packaging and Testing Project was officially capped recently, and earlier in September, its investment of 10 billion yuan was laid for the second phase of Huatian Nanjing Integrated Circuit Advanced Packaging and Testing Industrial Base.

In terms of Tongfu Microelectronics, its two advanced packaging and testing bases with a total investment of more than 10 billion yuan have also made new progress. According to Nantong News, on September 20, the groundbreaking ceremony of the Tongfu Tongda Advanced Packaging and Testing Base Project was held in the North High-tech Zone of Nantong City. On the same day, the first equipment of the second phase of Tongfu Tongke Memory project was officially settled, marking a new breakthrough in the two sub-projects of Tongfu Advanced Packaging and Testing Base, a major project of 10 billion yuan, on the same day.

Recently, Yongsi Electronics announced that the company intends to raise a total of no more than 1.2 billion yuan, which will be used for multi-dimensional heterogeneous advanced packaging technology research and development and industrialization projects, replenishment of working capital and repayment of bank loans after deducting issuance costs. According to the announcement, the total investment of Yongsi Electronics' multi-dimensional heterogeneous advanced packaging technology R&D and industrialization project is 1.464 billion yuan, the planned construction period is 36 months, and the proposed use of funds raised is 900 million yuan, accounting for 75% of the total fundraising. The second phase of the company's factory was completed in September last year, with a construction area of more than 380,000 square meters and a total investment of 11.1 billion yuan

PACKAGING AND TESTING MANUFACTURER JINGFANG TECHNOLOGY ALSO ISSUED AN ANNOUNCEMENT IN THE MIDDLE OF THIS YEAR, SHOWING THAT THE COMPANY PLANS TO PROVIDE A CONTRACT TO ITS MALAYSIAN SUBSIDIARY OPTIZ PIONEER HOLDING PTE. LTD (hereinafter referred to as "OPTIZ PIONEER") increased its investment by US$30 million to actively promote the construction of the company's manufacturing base in Malaysia. According to the announcement, the Malaysian subsidiary of Jingfang Technology has completed the registration and establishment of the company's corporate name is WaferTek Solutions Sdn Bhd (hereinafter referred to as "WaferTek"), and OPTIZ PIONEER holds 100% of the shares of WaferTek. WaferTek is currently in talks to purchase the land and plant in Penang, Malaysia, and is in the process of drafting and signing the purchase agreement. After the signing of the agreement, the company will actively promote the closing procedures related to the transaction in the future.

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