Single Wafer Backside Etcher

The SC200-B02 is efficient, intelligent and accurate. It is capable of cleaning and etching the backside of 6- to 8-inch wafers, demonstrating great versatility. The PC+PLC control system ensures the intelligence and stability of the operation, supports a variety of industry standard protocols, and is easily integrated into the modern production line. The application of Bernoulli Fork manipulator has improved the accuracy and efficiency to a new level, and the whole process of contactless operation protects the wafer intact. Coupled with excellent temperature, concentration, pressure and flow control, this machine is undoubtedly the ideal choice to improve production efficiency and ensure product quality.

Bench Cleaning

BL300-A06 is a multi-functional machine designed for 12-inch wafers, suitable for RCA cleaning, PR STRIP, dielectric film etching, metal etching, organic cleaning and wafer regeneration and other processes. The equipment adopts advanced PC+PLC configuration and supports a variety of industry standard protocols such as E84, GEM/SECS, EAP, FDC, etc., to ensure a high degree of automation and intelligence in operation. BL300-A06 is equipped with 6 customizable process tanks, which can be flexibly adjusted according to customer needs, and has a complete safety protection mechanism, including anti-collision, water leakage and automatic fire protection system, which provides a solid guarantee for the safe operation of the equipment.

Bench RCA Cleaning

BC200-A06 is a multi-functional equipment for 6" and 8" wafers, covering RCA cleaning, PR STRIP, dielectric film etching, metal etching, organic cleaning and wafer regeneration. Its excellent process indicators include very low fragmentation rate (≤1/100,000), high reliability (UPTIME ≥95%), and excellent particle control (Particle≤20@0.16um). Optional high-end accessories such as cassette exchanger and CDS concentration meter, as well as good temperature, concentration, pressure and flow control functions, make the BC200-A06 maintain excellent performance in various complex processes.

Single PR Remove

The SR300-F05 is a photoresist and polymer removal device for 6-inch, 8-inch and 12-inch wafers. The SR300-F05 offers customizable tank configurations, including 1 to 2 immersion tanks, 1 to 4 high-pressure flushing chambers, and 1 to 4 wash-dry chambers to meet different production needs. The multi-stage filter mechanism design makes maintenance easier, and high-end accessories such as the DICO2 configuration and CDS concentration meter are available to further enhance the functionality and flexibility of the equipment. Good temperature, concentration, pressure and flow control enable the SR300-F05 to maintain excellent performance in a variety of complex processes.

Single Wafer Etcher

The SC300-F08 is a high-efficiency single etching and cleaning machine designed for 12-inch wafers. The equipment adopts advanced PC+PLC configuration and supports a variety of industry-standard protocols such as GEM/SECS, EAP, E84, etc., ensuring a highly automated and intelligent operation experience. In addition, the equipment also has a powerful chemical recovery system, with a recovery rate of more than 95%, which effectively reduces production costs. The SC300-F08 exhibits excellent performance and is ideal for single wafer etcher.

< 1 >